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Offer
From Non Premium Member |
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Type: |
Sell |
| Subject: |
High Reliability FR4 Thin Core & Prepreg |
| Description: |
Thin Core & Prepreg
High Tg (> 140/ 150 oC)
Phenolic cured (Dicy Free) system
High Td (decomposition temp. > 340 oC by TGA)
Lead free process compatible
Lower Coefficient of Thermal Expansion (< 3.5% from 50 – 260oC)
High heat resistance demonstrated by T-260, T-288 and T-300
T-260 > 60 min.
T-288 > 15 min.
T-300 > 3 min.
Over 15 cycles by thermal stress 288 oC and 310 oC, 10 sec solder float
Suitable for Lead-Free process
Lower CTE in Z-direction
High Reliability – Superior CAF restraining property
Filler
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| Placement Date: |
Jul 16, 2007 |
| Expiration Date: |
Jul 15, 2008 |
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Company Name: |
Mica-AVA (Far East) Industrial Ltd |
| Contact Person: |
Craigavon Ng |
| City: |
Hong Kong |
| Country: |
China
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| Local Time: |
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| E-mail: |
Premium
Membership Required (Join Free Today) |
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| Introduction: |
Copper Clad Laminate FR4 (Thin Core & Prepreg) for PCB maker |
| Business Type: |
Exporter, Manufacturer |
| Areas of Interest: |
1. Raw Materials/Metals
2. Electronics & Electricals/Communications
3. Electronics & Electricals/Components
4. Electronics & Electricals/Consumer Electronics
5. Electronics & Electricals/Other
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