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Company Name: |
Mica-AVA (Far East) Industrial Ltd |
Contact Person: |
Craigavon Ng |
City: |
Hong Kong |
Country: |
China
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Local Time: |
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E-mail: |
Premium
Membership Required (Join Free Today) |
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Introduction: |
Copper Clad Laminate FR4 (Thin Core & Prepreg) for PCB maker |
Business Type: |
Exporter, Manufacturer |
Areas of
Interest: |
1. Raw Materials/Metals 2. Electronics & Electricals/Communications 3. Electronics & Electricals/Components 4. Electronics & Electricals/Consumer Electronics 5. Electronics & Electricals/Other
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Offers
From This Member (2) |
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[Sell] High Reliability FR4 Thin Core & Prepreg |
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Thin Core & Prepreg High Tg (> 140/ 150 oC) Phenolic cured (Dicy Free) system High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible Lower Coefficient of Thermal Expansion (< 3.5% from 50 – 260oC) High heat resistance demonstrated by T-260, T-288 and T-300 T-260 > 60 min. T-288 > 15 min. T-300 > 3 min. Over 15 cycles by thermal stress 288 oC and 310 oC, 10 sec solder float Suitable for Lead-Free process Lower CTE in Z-direction High Reliability – Superior CAF restraining property Filler
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» Electronics & Electricals/Communications |
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[Sell] Copper Clad Laminate FR4 |
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Thin Core & Prepreg High TGA value, higher temperature resistance With Special formulated Filler inside Extra Low Z axis CTE Low Water absorption Low Melt-Flow, wider pressing window Tg ~ 170C UV / AOI Lead Free process compatible Normal High Tg pressing cycle Normal High Tg drilling parameters T260 > 60 minutes T288 > 20 minutes Td –340 – 360 deg.C (5% weight loss) Low Df (0.014 – 0.016 @ 1 GHz) Prepreg: 104, 106, 1080, 2113, 3313, 2116, 1501, 7628, 1037, 1086, 1078 CAF > 1000 hrs |
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» Electronics & Electricals/Communications |
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