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Company Name: Mica-AVA (Far East) Industrial Ltd
Contact Person: Craigavon Ng
City: Hong Kong
Country: China China
Local Time:
E-mail: Premium Membership Required (Join Free Today)
Introduction: Copper Clad Laminate FR4 (Thin Core & Prepreg) for PCB maker
Business Type: Exporter, Manufacturer
Areas of Interest: 1. Raw Materials/Metals
2. Electronics & Electricals/Communications
3. Electronics & Electricals/Components
4. Electronics & Electricals/Consumer Electronics
5. Electronics & Electricals/Other

Offers From This Member (2)

[Sell] High Reliability FR4 Thin Core & Prepreg View details for: High Reliability FR4 Thin Core & Prepreg
Thin Core & Prepreg
High Tg (> 140/ 150 oC)
Phenolic cured (Dicy Free) system
High Td (decomposition temp. > 340 oC by TGA)
Lead free process compatible
Lower Coefficient of Thermal Expansion (< 3.5% from 50 – 260oC)
High heat resistance demonstrated by T-260, T-288 and T-300
T-260 > 60 min.
T-288 > 15 min.
T-300 > 3 min.
Over 15 cycles by thermal stress 288 oC and 310 oC, 10 sec solder float
Suitable for Lead-Free process
Lower CTE in Z-direction
High Reliability – Superior CAF restraining property
Filler
» Electronics & Electricals/Communications
[Sell] Copper Clad Laminate FR4 View details for: Copper Clad Laminate FR4
Thin Core & Prepreg
High TGA value, higher temperature resistance
With Special formulated Filler inside
Extra Low Z axis CTE
Low Water absorption
Low Melt-Flow, wider pressing window
Tg ~ 170&#61616;C
UV / AOI
Lead Free process compatible Normal High Tg pressing cycle
Normal High Tg drilling parameters
T260 > 60 minutes
T288 > 20 minutes
Td –340 – 360 deg.C (5% weight loss)
Low Df (0.014 – 0.016 @ 1 GHz)
Prepreg: 104, 106, 1080, 2113, 3313, 2116, 1501, 7628, 1037, 1086, 1078
CAF > 1000 hrs
» Electronics & Electricals/Communications
1 - 2 of 2, Total 1 Pages

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