|
|
Offer
From Non Premium Member |
|
|
|
Type: |
Sell |
Subject: |
High Reliability FR4 Thin Core & Prepreg |
Description: |
Thin Core & Prepreg High Tg (> 140/ 150 oC) Phenolic cured (Dicy Free) system High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible Lower Coefficient of Thermal Expansion (< 3.5% from 50 – 260oC) High heat resistance demonstrated by T-260, T-288 and T-300 T-260 > 60 min. T-288 > 15 min. T-300 > 3 min. Over 15 cycles by thermal stress 288 oC and 310 oC, 10 sec solder float Suitable for Lead-Free process Lower CTE in Z-direction High Reliability – Superior CAF restraining property Filler
|
Placement Date: |
Jul 16, 2007 |
Expiration Date: |
Jul 15, 2008 |
|
|
|
|
|
|
Company Name: |
Mica-AVA (Far East) Industrial Ltd |
Contact Person: |
Craigavon Ng |
City: |
Hong Kong |
Country: |
China
|
Local Time: |
|
E-mail: |
Premium
Membership Required (Join Free Today) |
|
Introduction: |
Copper Clad Laminate FR4 (Thin Core & Prepreg) for PCB maker |
Business Type: |
Exporter, Manufacturer |
Areas of Interest: |
1. Raw Materials/Metals 2. Electronics & Electricals/Communications 3. Electronics & Electricals/Components 4. Electronics & Electricals/Consumer Electronics 5. Electronics & Electricals/Other
|
|